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Home/Participants/Products/Atomated double-sided magnetron deposition system Caroline D12B3

Atomated double-sided magnetron deposition system Caroline D12B3

Atomated double-sided magnetron deposition system Caroline D12B3 Manufacturer: RU-VEM
Contact name: Mikhail Suvorov
Email: info@ru-vem.ru
Phone: (499) 710-60-00, (499) 710-60-11
Website: www.ru-vem.ru

Main Purpose:

Caroline D12B3 system is designed for double-sided magnetron deposition on silicon, ceramic or any flat substrates of diameter less than 150 mm (substrate thickness should be less than 30 mm). Maximum surface processing - 150x350 mm.

Technical characteristics and functional parameters:

Substrate holders are located on rotating drum. The system is equipped with 4 pairs of magnetron units, so sputter deposition is performed in wertical direction on the inner side and the outer side of substrates. The system's vacuum chamber has a specific door equipped with two heaters and an ion source.

Magnetron units of the system are capable for sputtering any material, including resistive alloys of Cu, Cr, Ni, Al, etc.

Technical specification:

The number of substrates processed for one sputtering cycle, double-sided

70 pcs. 60x48

processing, mm:

48 pcs. 0100, 28 pcs. 0150;

single-sided processing, mm:

111 pcs. 60x48

Automatic shutter control; at the same time shutters can be open for deposition either at even positions (2 and 4) or at odd positions (1 and 3)

Working gas consumption for each channel, l/hour

0÷9

The number of working gases (non-aggressive)

up to 3

Cleaning modules

1

Magnetron units

up to 7

Magnetron type (for film deposition)

mid-frenquency pulsed

Magnetron working current, controlled, A

3÷30

Magnetron voltage, V

300÷650

Targets dimensions (indirectly cooled complex targets can be used), mm

440x100x6÷15

Allowed pressure in sputtering chamber, Pa

0,07÷0,3

The witness piece of substrate resistance range, kn

0,2÷20

Resistivity measurement uncertainty,%

±1

Substrates temperature Instability, %

±5

Recommended temperature of substrates (°C, max 700)

50÷250 (350 optional)

Umiting residual pressure in working chamber, Pa

8x10-4

Total system start-up time including cryopump warm-up, min

< 120

Overall dimensions of the system, with lifted chamber (width x depth x height), mm

1750x2000x2980

Total weight, including power and control units, kg

<2300


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