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Automated magnetron deposition system Caroline D12С

Automated magnetron deposition system Caroline D12С Manufacturer: RU-VEM
Contact name: Mikhail Suvorov
Email: info@ru-vem.ru
Phone: (499) 710-60-00, (499) 710-60-11
Website: www.ru-vem.ru

Main Purpose:

Caroline D12C is a batch sputtering system. It is designed for magnetron deposition on any flat substrates smaller than 150 diameter (substrate thickness should be less than 30 mm). Maximum surface processing - 150x650 mm. Magnetron units (up to 4) are placed inside the drum and sputter deposition is performed in vertical direction. Magnetron units of the system are capable for sputtering any material, including resistive alloys of Cu,Cr,Ni,Al.

Technical characteristics and functional parameters:

The number of substrates processed for one sputtering cycle, double-sided

96 pcs. ∅100 176 pcs.60x48

Automatic shutter control for all targets

Working gas consumption for each channel, l/hour

0÷9

The number of working gases (non-aggressive)

up to 3

Ion cleaning module

1

Magnetron units

up to 4

Magnetron type (for film deposition)

mid-frenquency pulsed

Magnetron working current, controlled, A

0,5÷15 (30-optional)

Magnetron voltage, V

up to 650

Targets dimensions (indirectly cooled complex targets can be used), mm

749x100x6÷15

Allowed pressure in sputtering chamber, Pa

0,07÷0,3

Bias generator power, kVA

4

Bias sputtering on the cooled substrate (pulsing frequency 100 kHz)

Optional

The witness piece of substrate resistance range, kn

0,2÷20

Resistivity measurement uncertainty,%

±1

Substrates temperature Instability, %

±5

Recommended temperature of substrates (°C, max 700)

50÷250 (350 optional)

Limiting residual pressure in working chamber, Pa

8x10-4

Total system start-up time including cryopump warm-up, min

< 120

Overall dimensions of the system, with lifted chamber (width x depth x height), mm

1450x1660x3130

Total weight, including power and control units, kg

<1850


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