Manufacture of printed circuit boards

•  The number of layers - up to 18.
• Conductor-gap:

- To foil 18 microns - 0,10-0,10 mm

- To foil 35 microns - 0,15-0,15 mm

- To foil 70 microns - 0,20-0,20 mm

- To foil 105 microns - 0,25-0,25 mm

• The minimum contact area (to foil 18mkm):

- To plated holes to 2.0 mm - 0.3 mm

- To plated holes over 2.0 mm - 0.5 mm

• The minimum diameter of the metallized holes (for boards of different thicknesses, this parameter is different, the ratio of height to bore diameter ratio is 5: 1) - 0.2 mm
• Resolution marking paint (minimum line width) - 0.15 mm
• The thickness of the copper foil - 18, 35, 70, 105 microns
• Machining contour:

- Stamp - tolerance of +/- 0.2 mm

- Milling Contours - tolerance of +/- 0.2 mm

- scribing - tolerance of +/- 0.25 mm