Production technology: CMOS, BiCMOS, MEMS.
Project standard: 0.6 μm - 0.35 μm.
Diameter of silicon wafer: 150 mm, 200 mm (BEOL).
Production capacity: 600 wafers per month.
special technology routes on up-to-date high tech equipment.
high-temperature and radiation-resistant electronics.
flexible pricing policy.
prototyping for R&D and series of pilot batches (small amounts of a wide range).