
Company:
Center "Diagnosis and modification of microstructures and nanostructures" MIET
Contact name: Kukin Vladimir
Email:
kukin@miee.ru
Phone: +7 (499) 720-87-65
Website:
www.miee.ru
Key limit /boundary/ process parameters:
- automated local opening plastic cases of integrated circuits using chemical etching;
- etching plasma reactive gases, can remove passivirushie and insulating layers in the analysis of the topology and structure of integrated circuits;
- research, monitoring and photographing models of articles micro- and nanoelectronics, including silicon wafers with a diameter up to 200 mm
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